LONDON--(BUSINESS WIRE)--According to the latest market study released by Technavio, the global low-temperature co-fired ceramic (LTCC) substrate market is projected to grow to USD 285.13 million by ...

To be shown at ECTC 2026, May 26-29 in Orlando; new substrate technology delivers superior rigidity and circuit miniaturization for next-gen data centers, AI, and ASIC packaging Built from Kyocera’s ...

Celcor-600/2-substrates, a next-generation ceramic for light-duty gasoline and diesel-powered vehicles, reportedly helps lower fuel consumption and boosts engine power by helping lower exhaust system ...

Taiwan-based Leatec Fine Ceramics, a dedicated maker of aluminum and ceramic substrates needed for manufacturing chip resistors, is mulling raising its quotes in the wake of a recent 15% price hike ...

USI stated that the combination of low stray inductance, minimal on-resistance, and superior thermal performance delivers a significant boost in energy conversion efficiency and system reliability.

Where ceramic packaging and substrates are employed. Why designing solutions with ceramic packaging and substrates is challenging. Ceramic packaging and substrates address high-performance and ...

Electronics, Inc’s TNC Series of NTC thermistors provide a proven alternative as a robust alternative to multilayer thermistors for temperature sensing applications. Utilising thick film technology, ...

Semiconductor manufacturing faces a new bottleneck. See how advanced packaging and laser-based tooling fix back-end supply chains.