One of the main challenges of a Dual Damascene (DD) via-first process is the control of the Critical Dimensions (CDs) in the lithography of the trenches. The PhotoResist (PhR) thickness presents ...
MINNEAPOLIS–FSI International Inc. said it has signed a cooperative agreement with Novellus Systems Inc. to join the Damascus Alliance. The alliance is a group of semiconductor equipment companies ...
International Sematech engineers have qualified a porous, ultra low-k material for dual damascene copper processing at 0.13-micron feature sizes using 193nm lithography on 300mm wafers, the consortium ...
Improvements in the deposition of copper will usher in new ultralarge-scale ICs. Copper has become the material of choice for fabricating connections on ultralarge scale integrated circuits. The ...
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