Please provide your email address to receive an email when new articles are posted on . LAS VEGAS — Results presented at the American Academy of Orthopaedic Surgeons Annual Meeting showed arthroplasty ...
Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, ...
A recent research published in Engineering has unveiled a novel analysis-oriented stress–strain model that promises to revolutionize the way engineers understand and design with ultra-high-performance ...
Strain can be introduced to materials through various methods, including mechanical stretching, bending, compressing, or by epitaxial growth on substrates with different lattice constants. Advanced ...
The entire stress-strain curve can now be determined using nanoindentation with a flat-ended cylindrical punch and novel analysis of the resulting force-displacement data 1. Unlike pyramidal indenters ...
With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...
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