Ottawa, Nov. 26, 2025 (GLOBE NEWSWIRE) -- The global semiconductor and IC packaging materials market generated revenue of USD 48.48 billion in 2025, and this figure is projected to grow to USD 114.28 ...

Solutions for inline X-ray inspection and wafer warpage correction address key challenges in advanced semiconductor ...

Ottawa, Oct. 22, 2024 (GLOBE NEWSWIRE) -- The global semiconductor & IC packaging materials market size is predicted to increase from USD 48.54 billion in 2025 to approximately USD 113.29 billion by ...

Display driver IC packaging materials suppliers have recently landed a pull-in of short lead-time orders, which DDI backend firms regard as a short-term phenomenon. Advanced Semiconductor Engineering ...

An announcement from Innometry Co., Ltd. ( ($KR:302430) ) is now available. Innometry Co., Ltd. operates in the technology ...

The investment underscores the growing importance of advanced packaging materials in the semiconductor supply chain Japanese semiconductor materials giant Sumitomo Bakelite plans to expand production ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while ...

While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...

TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...

Not so long ago, defense and aerospace applications were the traditional drivers of advances in electronic packaging technologies, or "the way electronic systems are assembled." At the time, cost was ...

Taiwan-based driver IC OSATs such as ChipMOS Technologies and Chipbond Technology are seeing the monthly operating growth rate of chip and backend companies exceed 20%, according to... Ample ...