Cleaving is a simple yet rapid method used to prepare samples of silicon and other semiconductor materials; however, despite being a single crystal material, sapphire does not cleave well. Existing ...

This article shows how to prepare samples and downsize wafers in the cleanroom, without compromising the cleanliness of the wafers or cleanroom. In this article, the LatticeAx 420 scribeless cleaving ...

The elimination of sawing kerf loss combined with its ability to make thinner wafers of high quality make the implant-cleave wafering approach technically and economically attractive. For example, ...

The SiGen NanoTec layer transfer tools and processes are built around two key process requirements: (1) strong atomic layer bonding of semiconductor wafers using SiGen Plasma Activation Technology and ...

Starting with a whole wafer, this instructional video shows you how to downsize a wafer into die sized pieces. The process results in high quality, clean samples that can be used for further analysis.

First, it is used for downsizing the bare 2” or 3” wafer prior to fabrication of the nanostructures. Cleaving of the wafers is carried out along the crystallographic direction. Then, each wafer is ...

Here, Vidya Vijay, Director of Business Development at Nordson Test and Inspection, examines how intelligent in-situ sensing ...

This is the dawning of the age of materials for the semiconductor industry. For process engineers trying to integrate all of the new and exotic materials in an attempt to keep semiconductors scaling ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...