President Trump's agreement with Japan unlocks up to $21 billion investment to expand foundational semiconductor production, ...

Collaboration aims to accelerate development of the manufacturing and design capabilities needed for future nanostack ...

Siemens today announced significant advances in its collaboration with NVIDIA to accelerate computational lithography workflows.

Nexus and Oscar are Eliyan’s first NuLight chiplet products that enable optical connectivity designed for the high-bandwidth, extended reach, and low-power requirements of large AI scale-up and future ...

NVIDIA today announced semiconductor leaders are adopting NVIDIA CUDA-X libraries — including the new NVIDIA cuPotential library, which developers can use to build AI agents that simulate how atoms ...

Ahead of his presentation at SEMICON West, Chris Jones, Environmental Sustainability Manager at Edwards, argues that framing misses most of what actually drives a fab’s environmental performance.

SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, today announced Kulicke & Soffa as the recipient of the 2026 SEMI Award for ...

ETEL, the supplier of high-performance motion control components and complete motion platforms, is proud to introduce the METIS HP, a new full air bearing planar platform designed for the most ...

Global 300mm front-end fab equipment spending is projected to reach $149 billion in 2026, up 31% year-over-year, SEMI ...

Nikon Corporation will release the DSP-110 digital lithography system for semiconductor advanced packaging in April 2027.

New connectivity, storage and acceleration solutions help address performance, security and scalability challenges across modern computing architectures.

The Centra Smart Hub, combined with Advanced Energy’s new Remote Smart Sensors (RSS), enables more accurate wafer-temperature measurement and real-time temperature control for many lamp-heated Si and ...